微特电机 ›› 2021, Vol. 49 ›› Issue (11): 30-33.

• 设计分析 • 上一篇    下一篇

车用电机控制器散热结构及热仿真分析

童莉莉1, 丁永根2, 李星明2   

  1. 1.上海电驱动股份有限公司,上海 201806;
    2.上海汽车电驱动有限公司,上海 201806
  • 收稿日期:2021-07-12 出版日期:2021-11-28 发布日期:2021-11-16
  • 作者简介:童莉莉(1980—),女,工程师,主要研究领域为新能源汽车用电机结构设计、工业工程等。
  • 基金资助:
    国家科技支撑计划(2015BAG03B01)

Cooling Structure and Thermal Analysis of Electric Motor Controller for Vehicle

TONG Li-li1, DING Yong-gen2, LI Xing-ming2   

  1. 1. Shanghai Edrive Co., Ltd., Shanghai 201806, China;
    2. Shanghai Vehicle Edrive Co., Ltd., Shanghai 201806, China
  • Received:2021-07-12 Online:2021-11-28 Published:2021-11-16

摘要: 以某型号混联客车电机控制器为研究对象,对电机控制器的传热性能、功率模块损耗进行分析。结合有限元模拟分析软件ANSYS,对影响控制器散热性能的关键工艺因素(冷却水道结构、进水口流量、导热硅脂层厚度)进行仿真分析。结果表明:功率模块IGBT为控制器内部主要热源,其功率损耗约为2 652 W;控制器冷却水道结构对散热效果影响明显,冷却水在水道内主要以湍流形式流动,且S形水道结构散热效果更好;冷却介质流量增大时,控制器稳态工作时IGBT功率模块芯片最高逐渐降低,当流量为20 L/min时芯片最高温度为105.5 ℃;添加导热硅脂对IGBT功率模块芯片温度影响明显,当导热硅脂层厚度为100 μm控制器稳态工作时芯片最高温度约为103 ℃。

关键词: 控制器, 损耗, IGBT, 散热, 导热硅脂

Abstract: The motor controller was taken as the research object and the heat transfer performance and power module loss were analyzed. The finite element simulation software ANSYS was used to simulate the key process factors (cooling channel structure, water flow, thickness of thermal grease layer) affecting the controller's thermal performance. The results showed that the power module IGBT was the main heat source inside the motor controller, and its power loss was about 2 652 W. The cooling structure of the motor controller had a significant effect on the cooling effect. The cooling water in the water channel flowed mainly in the form of turbulent flow, and the cooling effect of S-shaped water channel structure was better. At the working condition of steady state, with the flow rate of the cooling medium increasing, the highest temperature of IGBT power module chip was decreasing. When the flow rate was 20 L/min, the maximum temperature of the chip was 105.5 ℃.The thermal grease had a significant effect on the cooling effect as well. When the thermal grease thickness was 100 μm, the maximum temperature of the chip was approximately 103 ℃.

Key words: motor controller, power loss, IGBT, cooling, thermal grease

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